SST International : Horno con vacio

SST International es el lider mundial en Package Assembly

SSTSST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over twenty-five years, SST has provided flux-free and void-free soldering, brazing and glass sealing solutions to the world-wide electronics industry. SST’s team of leading engineers and technologists are constantly advancing the state-of-the-art in microelectronic package assembly techniques, processes and equipment.

 
 

















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Wedge Wire Bonding

Hesse & Knips : Modelos Wedge wire bonding Bondjet BJ715/815 

Bonder automatico Wedge-Wedge [ ... ]


Die attach, flip chip, dispensing Prototipos

MAT Micro Assemby Technologies, Ltd: Modelos Die Attach, Flip Chip y dispensing MAT 6400:

Para [ ... ]


Encapsulado Prototipos

Miyachi Unitek : Modelos Encapsulados Modelo SM 8500

The SM 8500 is performs parallel resist [ ... ]


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