Loadpoint : Modelo Micro cortadora

Micro Ace Series 3:

The MicroAce series 3 provides a complete micro-dicing solution for the precision dicing, scribing and grinding needs of the Electronic/ Semiconductor industry.

It is capable of processing a wide range of materials including Silicon, Ferrite, Glass, Germanium, PZT and Sapphire up to 6 inch/152 mm in diameter.


MicroAce Series 3

Descarga Folleto Micro Ace Serie 3

 
 












 
Optical Leak Testing

NORCOM : Optical Leack Testing Estamos trabajando en este contenido, disculpen las molest [ ... ]


+
Wedge & Ball Wire Bonding

TPT: Modelos Ball & Wedge Wire Bonder Manual /Semi Automática HB05 - Wedge & Ball Bonder

  [ ... ]


+
Linea de prototipos Microelectronica

Equipos para lineas de prototipos, investigación y desarrollo: Limpieza por Plasma >> [ ... ]


+
Otros articulos