Modelo 226 Pull Testing:

Affordable Wire Pull

• Dedicated wire pull system, for up to 100g
• High-end standard of accuracy and repeatability at an entry-level price
• Flexible and inexpensive way to perform precision destructive and
non-destructive testing (NDT) of wire bond loops
• Small footprint makes economic use of cleanroom space
• Meets requirements of MIL Standard 883 and is CE Certifi ed
• Download data to in-house SPC using RS232




Folleto PDF Royce 226

Modelo Royce 650- Bond Shear, Die Shear, Ball Pull, Wire Pull

System Features:
World language support
Small footprint with built in high quality Windows XP PC
Test modules range selectable down to 10% of full scale
200kg die shear capacity
One button microscope height adjustment
Large travel stage for up to 300mm wafers or substrates
Robust, guarded test modules
Rich data export and analysis options
Configurable user access controls
Comfortable, ergonomic joystick controls
Handles fine geometries with pitch down to 20 microns
Capable of high speed zone shear
Stud Pull capacity up to 200kgf
Tweezer pull to support cavity and fine pitch geometries
Precision Ball Pull to support a range of BGA applications



Folleto PDF Royce 650