Loadpoint : Modelo Micro cortadora Micro Ace Series 3: It is capable of processing a wide range of materials including Silicon, Ferrite, Glass, Germanium, PZT and Sapphire up to 6 inch/152 mm in diameter. |
Wedge & Ball Wire Bonding
TPT: Modelos Ball & Wedge Wire Bonder Manual /Semi Automática
HB05 - Wedge & Ball Bonder |
Microscopia SEC: Mini-SEM (Scanning Electron Microscope) This equipment has been designed to meet the n [ ... ] |
Die attach, flip chip, dispensing Prototipos
MAT Micro Assemby Technologies, Ltd: Modelos Die Attach, Flip Chip y dispensing
MAT 6400: |
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