TPT: Modelos Ball & Wedge Wire Bonder Manual /Semi Automática
HB05 - Wedge & Ball Bonder
For 17µ to 50µ Wire and 25µ x 200µ Ribbon
90° Bonding Deep-access
Bond arm length 165 mm
Stitch and bump bonding
20 Program storage capacities
Built in Heater stage Controller
2” Wire Spool
PLL Ultrasonic generator
6 : 1 ratio X-Y manipulator
Electronic ball size control
Folleto HB02 - Wedge Bonder
Folleto HB04 - Ball Bonder
Folleto HB05 - Ball & Wedge Bonder
HB10 - Semiautomatic Wire Bonder
Motorised Z-axis
for 17µ to 50µ Wire and 25µ x 200µ Ribbon
90° Bonding Deep-access
Bond arm length 165 mm
Motorised Z
Loop Height programable
Stitch and bump bonding
20 Program storage capacities
Built in Dual Fiber Optic illuminator
Built in Heater stage Controller
Motorised 2” Wire Spool
PLL Ultrasonic generator
6 : 1 ratio X-Y manipulator
Electronic ball size control
Semi-automatic and manual bonding
Folleto HB06 Wedge Bonder
Folleto HB08 Ball Bonder
Folleto HB10 Ball & Wedge Bonder
HB16 - Wedge & Ball Bonder
Motorized z & y axis
6,5” TFT Touch panel operation System
90° Bonding Deep-access
Bond arm length: 165 mm
Motorised Z & Yaxis
Loop Profile Software
Wedge- Ball- & Bump Bonding
Digital self tuning Ultrasonic generator
Wire & Ribbon bonding
Stitch bonding
Semi-automatic and manual bonding
99 Program storage capacities
Built in Dual Fiber Optic illuminator
Built in Heater stage Controller
Motorised 2” Wire Spool
Folleta HB12 - Wege Bonder
Folleto HB14 - Ball Bonder
Folleto HB16 - Ball & Wedge Bonder
HB16D- Wire & Die Bonder:
H80 Pick and Place Option for HB16 ( Also possible for HB10)
- Easy cchange from wire bonding to die bonding
- 6 to 1 fine ratio manipulator
- programmable force from 15cN up to 100cN
- programmable time from 0msec up to 5000msec
Folleto HB16D
HB30 Semiautomatic Heavy Wire Bonder
- 100µ to 500µ Wire
- 6,5” TFT Touch panel operation System
- 90° Bonding Deep-access
- Motorised Z & Y axis
- Loop Profile Software
- Semi-automatic and manual bonding
- Digital self tuning Ultrasonic generator
Folleto HB30