Loadpoint : Modelo Micro cortadora

Micro Ace Series 3:

The MicroAce series 3 provides a complete micro-dicing solution for the precision dicing, scribing and grinding needs of the Electronic/ Semiconductor industry.

It is capable of processing a wide range of materials including Silicon, Ferrite, Glass, Germanium, PZT and Sapphire up to 6 inch/152 mm in diameter.


MicroAce Series 3

Descarga Folleto Micro Ace Serie 3

 
 












 
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