MODUS : Modelo Inspección de pasta 2D

Upper AOI inspection system
Typical configuration for the inspection of solder paste, compo-nent placement and coatings.
Standard system with ASYS handling: length: 1500mm or 1590mm, 2 Segments, height: 850±50mm or 950±50mm.
Scanner is mounted in a maintenance-friendly hood.
Automatic electrical conveyor width adjustment.
Integrated lift-out station for one defective PCB
Escaner superior
















  







 
Estudio del test

ASTER : Testway La solución NPI para definir la estrategia de test:

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Rayos X

VJ Electronix : Rayos X Semi automático Vertex Serie A



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Rayos X

Teradyne : Rayos X Automático Automated 3D X-Ray Inspection

XStation MX is our flagship F [ ... ]


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