MODUS : Información adicional

Sensor system

The modus AOI optical inspection system uses a scanner, the optical sensor of which is equipped with a CCD line camera with RGB filter. The lighting system consists ofmultiple white, and coloured LED arrays positioned at different angles. This results inan image of high quality and contrast. The scanner acquires an image of the PCBs assembled area, the test time is to alarge extent independent of the amount components to be tested.
A reliable detection of unsoldered connectors, solder joints without pins and solderbridges etc, can be achieved through acquiring and analysing the image in colour,.thus guaranteeing a low pseudo error rate.













Description of the test algorithm and measurement process

For the creation of a reference image, a “Golden Board“ PCB must be scanned intothe system. The test plan is created using a library that was created from CAD orplacer data, additional test fields can be added manually using the test plan editor.
For the purpose of the evaluation the PCB to be tested, must be scanned into thesystem. Every THT solder joint is reliably tested according to its individualcharacteristics for sufficient solder, the presence of pins, pad contact (ball shapedsolder joint) and short circuits to neighbouring components.imagenKOmodusIn the case of an error, an enlarged versionof the template and original image aredisplayed to the right of the screen, and itsposition marked in the full image of thePCB. To monitor production fluctuations,the statistics module is available at all timesand shows the user the fluctuations of eachindividual test value.
The test time for a PCB with an area of410x300mm (16.2''x11.8'') and a resolutionof 600dpi is 12 seconds (1200dpi 24sec).



Application

Through its innovative concept, the modus AOI inspection system is an ideal solutionfor the optical monitoring of production processes. Through direct feedback to theerroneous process (Closed Loop), a long term improvement in quality and anoticeable reduction in costs can be achieved.
Apart from the above described THT solder joint inspection, the system is alsocapable of a number of different tasks including, solder paste inspection, placementof SMD and conventional components before the soldering process and mechanical components.





























 
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