SST International : Horno con vacio

SST International es el lider mundial en Package Assembly

SSTSST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over twenty-five years, SST has provided flux-free and void-free soldering, brazing and glass sealing solutions to the world-wide electronics industry. SST’s team of leading engineers and technologists are constantly advancing the state-of-the-art in microelectronic package assembly techniques, processes and equipment.

 
 

















Mas artículos...

 
Wedge & Ball Wire Bonding

TPT: Información Adicional  Ball & Wedge Wire Bonder Manual /Semi Automática Algunos li [ ... ]


Pull Tester

ROYCE : Modelos Pull & Shear Tester
Modelo 226 Pull Testing:

Affordable Wire Pull

• Dedicat [ ... ]


Die attach, flip chip, dispensing Prototipos

MAT Micro Assemby Technologies, Ltd: Modelos Die Attach, Flip Chip y dispensing MAT 6400:

Para [ ... ]


Otros articulos