Loadpoint : Modelo Micro cortadora

Micro Ace Series 3:

The MicroAce series 3 provides a complete micro-dicing solution for the precision dicing, scribing and grinding needs of the Electronic/ Semiconductor industry.

It is capable of processing a wide range of materials including Silicon, Ferrite, Glass, Germanium, PZT and Sapphire up to 6 inch/152 mm in diameter.


MicroAce Series 3

Descarga Folleto Micro Ace Serie 3

 
 












 
Limpieza Plasma Prototipos

March : Modelos de Limpieza por Plasma Modelo PX Series:

The PX-Series control module monit [ ... ]


+
Die attach, flip chip, dispensing Prototipos

MAT Micro Assemby Technologies, Ltd. : Die Attch, flip chip y dispending   MAT está espe [ ... ]


+
Test Funcional RF

AURIGA : Test Funcional RF De Auriga Measurement Systems ofrecemos equipos de test automa [ ... ]


+
Otros articulos