TPT: Modelos Ball & Wedge Wire Bonder Manual /Semi Automática

HB05 - Wedge & Ball Bonder

Without motorized axis

  • For 17µ to 50µ Wire and 25µ x 200µ Ribbon
  • 90° Bonding Deep-access
  • Bond arm length 165 mm
  • Stitch and bump bonding
  • 20 Program storage capacities
  • Built in Heater stage Controller
  • 2” Wire Spool
  • PLL Ultrasonic generator
  • 6 : 1 ratio X-Y manipulator
  • Electronic ball size control
    HB05-2009 
    Folleto HB02 - Wedge Bonder

    • Folleto HB04 - Ball Bonder

    Folleto HB05 - Ball & Wedge Bonder


    HB10 - Semiautomatic Wire Bonder

    Motorised Z-axis

  • for 17µ to 50µ Wire and 25µ x 200µ Ribbon
  • 90° Bonding Deep-access
  • Bond arm length 165 mm
  • Motorised Z
  • Loop Height programable
  • Stitch and bump bonding
  • 20 Program storage capacities
  • Built in Dual Fiber Optic illuminator
  • Built in Heater stage Controller
  • Motorised 2” Wire Spool
  • PLL Ultrasonic generator
  • 6 : 1 ratio X-Y manipulator
  • Electronic ball size control
  • Semi-automatic and manual bonding
    HB10
    Folleto HB06 Wedge Bonder

    • Folleto HB08 Ball Bonder

    Folleto HB10 Ball & Wedge Bonder


    HB16 - Wedge & Ball Bonder

    Motorized z & y axis

  • 6,5” TFT Touch panel operation System
  • 90° Bonding Deep-access
  • Bond arm length: 165 mm
  • Motorised Z & Yaxis
  • Loop Profile Software
  • Wedge- Ball- & Bump Bonding
  • Digital self tuning Ultrasonic generator
  • Wire & Ribbon bonding
  • Stitch bonding
  • Semi-automatic and manual bonding
  • 99 Program storage capacities
  • Built in Dual Fiber Optic illuminator
  • Built in Heater stage Controller
  • Motorised 2” Wire Spool
    HB16
    Folleta HB12 - Wege Bonder

    Folleto HB14 - Ball Bonder

    Folleto HB16 - Ball & Wedge Bonder

    • HB16D- Wire & Die Bonder:

    H80 Pick and Place Option for HB16 ( Also possible for HB10)

    • Easy cchange from wire bonding to die bonding 
    • 6 to 1 fine ratio manipulator
    • programmable force from 15cN up to 100cN
    • programmable time from 0msec up to 5000msec

    H80
    Folleto HB16D


    HB30 Semiautomatic Heavy Wire Bonder
    • 100µ to 500µ Wire
    • 6,5” TFT Touch panel operation System
    • 90° Bonding Deep-access
    • Motorised Z & Y axis
    • Loop Profile Software
    • Semi-automatic and manual bonding
    • Digital self tuning Ultrasonic generator


    HB30
    Folleto HB30

     
     
    Pick & Place Prototipos

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    Horno Vacio Prototipos

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    Test Funcional RF

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    Die attach, flip chip, dispensing Prototipos

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